Overview

This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. This tool features Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers. Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency. Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design. Easy to change rotors for simple reconfiguration to match any array of applications. A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime Supports Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry