This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. This tool features Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers. Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency. Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design. Easy to change rotors for simple reconfiguration to match any array of applications. A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime Supports Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry

Designed, developed & manufactured high performance and precision chemical processing equipment. Products included electrochemical deposition systems for electroplating copper, gold, solder and other metals; surface preparation systems for cleaning, stripping and etching silicon wafers; and wafer transport container cleaning systems.

SEMITOOL

SRD-870S

This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. This tool features Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers. Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency. Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design. Easy to change rotors for simple reconfiguration to match any array of applications. A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime Supports Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry






SRD-880S

The Spin Rinser/Dryer (SRD) is a tool that provides a high-speed rinse and dry of wafers. It is designed to achieve low particle counts and reduced DI water consumption, making it an efficient and effective tool for wafer processing. The SRD is 300mm ready, meaning it can accommodate wafers of that size. It also has the option for rinse dry or dry only, allowing for flexibility in its use.

This high performance tool cleans, rinses and dries product as large as 300mm round or 300mm square. With 25 wafers per chamber, this tool is available in single or double-bowl configurations. Introduced in 1979, over 25,000 units have shipped worldwide. The SRD can be configured to benchtop, stand-alone or bulkhead fab requirements. FEATURES Spray - On-axis orientation allows cold or hot (>50ºC) water to evenly spray the wafers Clean/Rinse - Built-in resistivity monitoring assures an automatic and reliable clean: the process chamber is cleaned with the product: quick-ramp, brushless DC motor provides economy and efficiency Dry - Centrifugal drying, coupled with heated, filtered nitrogen and a low-pressure nitrogen purge with blanket heaters Efficient Chamber Design Flexible - Easy to change rotors for simple reconfiguration to match any array of applications Fast - A typical 25-wafer payload takes <7 minutes for a complete cycle (load, rinse, spin dry, unload) Ultra Clean - On-axis orientation keeps wafers parallel, allowing fresh DI water manifolds to spray both sides of the product uniformly Efficient - Up to ten user-defined recipes Low CoO - Smallest footprint with the highest throughput available with over 95% uptime RELATED PROCESSES AND TECHNOLOGIES PROCESSES SUPPORTED Spray Clean (SRD) Spin-Rinse-DrySpray Clean (SRD) Spin-Rinse-Dry

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

SRD

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SRD-870S

SRD-880S

SRD

SRD-8300S