Description
No descriptionConfiguration
3D SPI system inline 3 D camera min. paste size 150x150µm max. paste size 20x20mm max. paste hight 1000µm min. PCB size 50x50mm max. PCB size 500x510m PCB thickness 0,4mm - 4mm measurements 1060mm (width) x 1285mm (length) x 1400mm (hight) weight 1000 kg Ask for additional information!OEM Model Description
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PARMI
HS60L
Verified
CATEGORY
Solder Paste Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
114018
Wafer Sizes:
Unknown
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PARMI
HS60L
CATEGORY
Solder Paste Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
114018
Wafer Sizes:
Unknown
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
3D SPI system inline 3 D camera min. paste size 150x150µm max. paste size 20x20mm max. paste hight 1000µm min. PCB size 50x50mm max. PCB size 500x510m PCB thickness 0,4mm - 4mm measurements 1060mm (width) x 1285mm (length) x 1400mm (hight) weight 1000 kg Ask for additional information!OEM Model Description
None ProvidedDocuments
No documents