Description
ScriberConfiguration
No ConfigurationOEM Model Description
The setup and the equipment of MR200 enables high precision scribing for defined cutting of structured silicon wafers. The MR200 is an indispensable tool, in particular for REM preparations in semiconductor technology. The MR200 is also suited for singling of chips in low numbers, for example in laboratory use.Documents
No documents
OEG
MR200
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82089
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
OEG
MR200
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82089
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ScriberConfiguration
No ConfigurationOEM Model Description
The setup and the equipment of MR200 enables high precision scribing for defined cutting of structured silicon wafers. The MR200 is an indispensable tool, in particular for REM preparations in semiconductor technology. The MR200 is also suited for singling of chips in low numbers, for example in laboratory use.Documents
No documents