Description
Completely Rebuilt 200mm dicing saw. This saw is capable of cutting 8″ wafers (200mm) on film frames. It is offered by JM Industries (25 years in the semiconductor industry) All new PLC controls, color touch screen, digital camera, 8″ diameter chuck with frame extensionsConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
120393
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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MICROAUTOMATION
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CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
120393
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Completely Rebuilt 200mm dicing saw. This saw is capable of cutting 8″ wafers (200mm) on film frames. It is offered by JM Industries (25 years in the semiconductor industry) All new PLC controls, color touch screen, digital camera, 8″ diameter chuck with frame extensionsConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents