Description
From semiconductor wafer to electronic parts, it can be processed in various ways It can be used for working objects with a maximum length of 6 inches and a width of 6 inches High precision index control can be achieved by using Y-axis scale (optional) With high torque 2.0kw spindle It can also be used to process glass, ceramics and other difficult cutting materials. In addition, high speed 1.8kw spindle can be selected (maximum rotation: 60000 min-1) as an option, it is a machine with high versatility.Configuration
No ConfigurationOEM Model Description
2014 Developed the DAD323, the world’s smallest footprint automatic dicing saw with expanded functionality. World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Diversified Processes The DAD323 is a single-axis dicing saw with a 2.0 kW high-torque spindle, compatible with workpieces as large as 6 x 6 inches. Adopting the Y-axis scale specification (optional) allows for high-precision index control and processing of difficult-to-process materials, including glass and ceramics. In addition, DAD323 is a versatile model and can be equipped with a 1.8 kW high-rotation spindle (highest rotation speed: 60,000 min-1) as an option.Documents
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DISCO
DAD323
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112215
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DAD323
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112215
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
From semiconductor wafer to electronic parts, it can be processed in various ways It can be used for working objects with a maximum length of 6 inches and a width of 6 inches High precision index control can be achieved by using Y-axis scale (optional) With high torque 2.0kw spindle It can also be used to process glass, ceramics and other difficult cutting materials. In addition, high speed 1.8kw spindle can be selected (maximum rotation: 60000 min-1) as an option, it is a machine with high versatility.Configuration
No ConfigurationOEM Model Description
2014 Developed the DAD323, the world’s smallest footprint automatic dicing saw with expanded functionality. World’s Smallest* Dicing Saw which Supports Diversified Processing from Semiconductor Wafers to Electric Components Diversified Processes The DAD323 is a single-axis dicing saw with a 2.0 kW high-torque spindle, compatible with workpieces as large as 6 x 6 inches. Adopting the Y-axis scale specification (optional) allows for high-precision index control and processing of difficult-to-process materials, including glass and ceramics. In addition, DAD323 is a versatile model and can be equipped with a 1.8 kW high-rotation spindle (highest rotation speed: 60,000 min-1) as an option.Documents
No documents