Description
Laser saw Die separator DFL7362 is DISCO laser saw(Not back grinder), and it is with DDS2300, wafer sorter in turn key.Configuration
Chuck/table size (Has 12 inch spec now) - Usage : Laser Diode - 1306.60 Hrs. Laser Head - 19082.40 Hrs. - Laser Source Type : SD06 typeOEM Model Description
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.Documents
DISCO
DFL7362
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
128847
Wafer Sizes:
12"/300mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available