Description
Laser sawConfiguration
No ConfigurationOEM Model Description
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.Documents
No documents
DISCO
DFL7362
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 29 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
128847
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Laser sawConfiguration
No ConfigurationOEM Model Description
2017 Developed DFL7362, a stealth dicing laser saw that achieves higher throughput. Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si Φ300 mm Stealth Dicing™ SDBG SDTT DFL7362 is a fully-automatic laser saw for Φ300 mm wafers used mainly to singulate ultra-thin Si wafers. Si with a thickness of 50 µm or less can be singulated at high speed while maintaining high die strength. The equipment offers both wafer and frame transferring, making it possible to support a wide range of applications.Documents
No documents