Skip to main content
Moov logo

Moov Icon
DISCO DFL7361
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.
    Documents

    No documents

    verified-listing-icon

    Verified

    CATEGORY
    Scribing, Cutting, Dicing

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    124278


    Wafer Sizes:

    12"/300mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    DISCO DFL7361

    DISCO

    DFL7361

    Scribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    DISCO

    DFL7361

    verified-listing-icon
    Verified
    CATEGORY
    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-51a600e826134d33b5a9978f4e6f0915-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    124278


    Wafer Sizes:

    12"/300mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Disco-DFL7361 is a laser saw developed by Disco Corporation. It uses a processing method called Stealth Dicing, which focuses a laser within the workpiece to form a modified layer. Die separation is achieved with a tape expander. This method controls cutting waste because only a subsurface layer is processed, making it suitable for workpieces that are vulnerable to contamination.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFL7361

    DISCO

    DFL7361

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    DISCO DFL7361

    DISCO

    DFL7361

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    DISCO DFL7361

    DISCO

    DFL7361

    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified:Over 60 days ago