Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.Documents
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DISCO
DFL7341
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 16 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152272
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing Φ200 mm Stealth Dicing™ SDBG SDTT DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide used in applications such as LED sapphire substrates and silicon microphones. Stealth Dicing™ process makes it possible for brittle materials such as SiC and GaN to be singulated without chipping. This is a completely dry process, making it suitable for processing devices such as MEMS that are susceptible to water damage.Documents
No documents