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DISCO DFL7340
  • DISCO DFL7340
  • DISCO DFL7340
Description
No description
Configuration
With 1064nm wavelength Laser and power 2.5w but for LED stealth saw It currently has a 4 inch chuck
OEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
Documents

No documents

DISCO

DFL7340

verified-listing-icon

Verified

CATEGORY
Scribing, Cutting, Dicing

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

67447


Wafer Sizes:

Unknown


Vintage:

2011


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO

DFL7340

verified-listing-icon
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
listing-photo-abdb24ce4f954e08a976edc4afe4508f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/abdb24ce4f954e08a976edc4afe4508f/c7595dc34fae47eaaed4a67b27b08f47_8a8c648434604a2f8b0ad3863a8033d91201a_mw.jpeg
listing-photo-abdb24ce4f954e08a976edc4afe4508f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1705/abdb24ce4f954e08a976edc4afe4508f/e61ede4281e94833953c09be325511f8_88b993d72e824413b96e0d1f1ca249a11201a_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

67447


Wafer Sizes:

Unknown


Vintage:

2011


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
With 1064nm wavelength Laser and power 2.5w but for LED stealth saw It currently has a 4 inch chuck
OEM Model Description
The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.
Documents

No documents

Similar Listings
View All