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    Key Item Details


    Operational Status:

    Product ID:96645

    Wafer Sizes:6"/150mm



    Laser Dicing Saw


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    OEM Model Description

    The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.

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