Skip to main content
Moov logo

Moov Icon
DISCO DFL7340
    Have one like this?Sell it with Moov
    Key Item Details

    Condition:Used

    Operational Status:

    Product ID:96645

    Wafer Sizes:6"/150mm

    Vintage:2011

    Description

    Laser Dicing Saw

    Configuration

    No Configuration

    Documents
    No documents
    OEM Model Description

    The DFL7341 is a fully automatic laser saw for Φ8-inch wafers which has seen wide use in applications such as LED sapphire substrates and silicon microphones. It uses a Stealth Dicing™ process that makes it possible for brittle materials such as SiC and GaN to be singulated without chipping.

    Available Services

    Moov goes beyond the transaction to ensure a seamless buying experience from start to finish.

    • Money Back Guarantee

      Now free!

      Let Moov take the risk out of purchasing secondhand equipment with our 'No questions asked Money Back Guarantee' Learn more

    • Logistics

      One stop shop for Moov-ing equipment anywhere globally.

    • Insurance

      Moov-ing equipment can be risky. Let us take on that risk so you can relax while your equipment is in transit.

    • Refurbishment

      Need a tool built to the required specifications? Moov's refurbishment team has over 20 years of experience.