Description
Fully Automatic Laser SawConfiguration
Details Attached Processing Mode - Ablation Max. workpiece size - 300mm X-Axis (Chuck Table): Processing Range - 310mm Moving Speed - 1~1,000mm's Y-Axis (Chuck Table: Processing Range - 310mm Index Step - 0.0001mm Positioning Accuracy - 0.003/310mm (Single error) 0.002/5mm Z-Axis: Moving Resolution - 0.000015mm Repeatability Accuracy - 0.002mm 0-Axis (Chuck table): Max. rotating angle - 330 (standard) 380 (option) Equipment Dimensions (WxDxH) - 1,560 x 1,550 x 1,800 Equipment Weight - Approx. 2,300kgOEM Model Description
The DFL7161 is a fully automatic laser saw for Φ300 mm wafers. It has a maximum processing range of 310 mm on both the X and Y axes and can move at speeds between 1 and 1,000 mm/s on the X-axis. The Z-axis has a moving resolution of 0.000015 mm and a repeatability accuracy of 0.002 mm. The θ-axis (Chuck table) has a maximum rotating angle of 330 degrees (standard) or 380 degrees (option). The equipment dimensions are 1,560 × 1,550 × 1,800 mm (W×D×H) and it weighs approximately 2,300 kg.Documents
DISCO
DFL7161
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
155153
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available