Description
Wafer SawConfiguration
No ConfigurationOEM Model Description
Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.Documents
No documents
DISCO
DFD681
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
110342
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD681
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
110342
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer SawConfiguration
No ConfigurationOEM Model Description
Disco DFD681 can handle a workpiece size of up to ø8” wafer and has a 2.2 kW Synchro SpindleTM air bearing spindle. The maximum blade size is 76.2 mm and it has a single spindle configuration. It also has enhanced productivity with automatic alignment and can be used for applications such as cutting Quartz, glass, ceramics, Lithium Niobate, Lithium Tantalate and other hard-to-cut materials.Documents
No documents