Description
No descriptionConfiguration
No ConfigurationOEM Model Description
2017 Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers. A space-saving solution for Φ300 mm dicing 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.Documents
No documents
DISCO
DFD6560
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
84221
Wafer Sizes:
Unknown
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFD6560
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
84221
Wafer Sizes:
Unknown
Vintage:
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
2017 Developed DFD6562, a small-footprint, fully automatic dicing saw that supports Φ300 mm wafers. A space-saving solution for Φ300 mm dicing 16% reduced footprint DFD6560 is equipped with uniquely developed short spindles and an optimized bridge-type frame structure resulting in a 16% reduced footprint. All maintenance can be performed from the front of the equipment, thus reducing the area needed for installation and maintenance areas by 20% (compared to the DFD6362). The DFD6560 is particularly ideal when installing multiple adjacent units.Documents
No documents