Description
DISCO DFD650 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD650 MFG No.: EP131 Manufacturing Date: October 1996 Spindle Configuration: Dual Spindle Maximum Spindle Speed: 60,000 rpm Power Supply: AC 200V, 3-phase Power Capacity: 4 kVA Air Pressure: 0.5 MPa Air Consumption: 350 NL/min N2 Pressure: 0.5 MPa N2 Consumption: 200 NL/min Cutting Water Pressure: 0.3 MPa Cutting Water Flow: 14 L/min Cooling Water Pressure: 0.2 MPa Cooling Water Flow: 3 L/min Machine Weight: 1,300 kg Fully automatic dicing saw for semiconductor wafer processing. Equipped with dual spindles and automatic wafer handling.Configuration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents
Similar Listings
View All
DISCO
DFD650
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
153628
Wafer Sizes:
Unknown
Vintage:
1996
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DISCO DFD650 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD650 MFG No.: EP131 Manufacturing Date: October 1996 Spindle Configuration: Dual Spindle Maximum Spindle Speed: 60,000 rpm Power Supply: AC 200V, 3-phase Power Capacity: 4 kVA Air Pressure: 0.5 MPa Air Consumption: 350 NL/min N2 Pressure: 0.5 MPa N2 Consumption: 200 NL/min Cutting Water Pressure: 0.3 MPa Cutting Water Flow: 14 L/min Cooling Water Pressure: 0.2 MPa Cooling Water Flow: 3 L/min Machine Weight: 1,300 kg Fully automatic dicing saw for semiconductor wafer processing. Equipped with dual spindles and automatic wafer handling.Configuration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents