Description
Wafer SawConfiguration
No ConfigurationOEM Model Description
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.Documents
No documents
DISCO
DFD641
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101437
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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DISCO
DFD641
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101437
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer SawConfiguration
No ConfigurationOEM Model Description
The Disco DFD641 has a maximum workpiece size of an ø8" wafer and is equipped with a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. It also features enhanced productivity with automatic alignment and is suitable for semiconductor device applications.Documents
No documents