Description
DISCO DFD6360 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD6360 Equipment Type: Fully Automatic Dicing Saw Maximum Workpiece Size: 300 mm (12 inch) Spindle Configuration: Facing Dual Spindle Spindle Quantity: 2 Spindle Type: Air Bearing Spindle Power: 1.2 kW Spindle Speed: 6,000–60,000 rpm X-axis Cutting Range: 310 mm X-axis Cutting Speed: 0.1–600 mm/s Y-axis Index Step: 0.0001 mm Positioning Accuracy: ±0.002 mm / 310 mm Z-axis Repeatability: 0.001 mm Maximum Blade Size: 2 inch Theta-axis Rotation: 380 degrees Machine Dimensions: 1,200 × 1,550 × 1,800 mm Machine Weight: Approx. 2,050 kg Fully automatic dicing saw featuring a facing dual-spindle configuration for precision wafer processing.Configuration
No ConfigurationOEM Model Description
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.Documents
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DISCO
DFD6360
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
153645
Wafer Sizes:
Unknown
Vintage:
2005
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DISCO DFD6360 Fully Automatic Dicing Saw Manufacturer: DISCO Model: DFD6360 Equipment Type: Fully Automatic Dicing Saw Maximum Workpiece Size: 300 mm (12 inch) Spindle Configuration: Facing Dual Spindle Spindle Quantity: 2 Spindle Type: Air Bearing Spindle Power: 1.2 kW Spindle Speed: 6,000–60,000 rpm X-axis Cutting Range: 310 mm X-axis Cutting Speed: 0.1–600 mm/s Y-axis Index Step: 0.0001 mm Positioning Accuracy: ±0.002 mm / 310 mm Z-axis Repeatability: 0.001 mm Maximum Blade Size: 2 inch Theta-axis Rotation: 380 degrees Machine Dimensions: 1,200 × 1,550 × 1,800 mm Machine Weight: Approx. 2,050 kg Fully automatic dicing saw featuring a facing dual-spindle configuration for precision wafer processing.Configuration
No ConfigurationOEM Model Description
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.Documents
No documents