Description
Wafer SawConfiguration
No ConfigurationOEM Model Description
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.Documents
No documents
DISCO
DFD6360
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79454
Wafer Sizes:
Unknown
Vintage:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DFD6360
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79454
Wafer Sizes:
Unknown
Vintage:
2003
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer SawConfiguration
No ConfigurationOEM Model Description
The DFD6360 workpiece has a maximum diameter of ø304.8 mm (ø12"). The air bearing spindle is a 1.0 kW Synchro Spindle and the maximum blade size is 61 mm. The spindle configuration is facing dual-spindles. The process method includes dual cut and step and bevel cut, which effectively reduces front and backside chipping and improves die strength. The graphical user interface allows for intuitive operation. This is suitable for applications such as semiconductor devices, ceramics, and glass.Documents
No documents