Description
**DISCO DFD6340 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD6340 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Facing Dual Spindle * Maximum Workpiece Size: 8-inch (200 mm) * Applications: Wafer Dicing, DBG (Dicing Before Grinding), Package Singulation **Technical Specifications** * Spindle Power: 1.2 kW / 1.8 kW / 2.2 kW (Options) * Spindle Speed: * 1.2 kW / 1.8 kW: 6,000–60,000 rpm * 2.2 kW: 3,000–30,000 rpm * X-Axis Cutting Range: 210 mm * X-Axis Cutting Speed: 0.1–600 mm/s * Y1/Y2-Axis Cutting Range: 210 mm * Index Step: 0.0001 mm * Positioning Accuracy: Within 0.002 mm / 210 mm * Z-Axis Maximum Stroke: * 19.22 mm (2-inch blade) * 19.9 mm (3-inch blade) * Z-Axis Moving Resolution: 0.00005 mm * Z-Axis Repeatability: 0.001 mm * θ-Axis Maximum Rotation: 380° **Dimensions & Weight** * Dimensions (W × D × H): 1,180 × 1,110 × 1,850 mm * Equipment Weight: Approx. 1,600 kg **Key Features** * Facing dual-spindle configuration * High-throughput dicing capability * Automatic wafer loading, unloading, cleaning, and drying * LCD touchscreen operation * Suitable for wafer dicing and package singulation *Specifications may vary depending on machine configuration and options. Please confirm the actual specifications of the available unit.*Configuration
No ConfigurationOEM Model Description
The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.Documents
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DISCO
DFD6340
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
153627
Wafer Sizes:
Unknown
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
**DISCO DFD6340 – Fully Automatic Dicing Saw** **General Specifications** * Manufacturer: DISCO Corporation * Model: DFD6340 * Equipment Type: Fully Automatic Dicing Saw * Spindle Configuration: Facing Dual Spindle * Maximum Workpiece Size: 8-inch (200 mm) * Applications: Wafer Dicing, DBG (Dicing Before Grinding), Package Singulation **Technical Specifications** * Spindle Power: 1.2 kW / 1.8 kW / 2.2 kW (Options) * Spindle Speed: * 1.2 kW / 1.8 kW: 6,000–60,000 rpm * 2.2 kW: 3,000–30,000 rpm * X-Axis Cutting Range: 210 mm * X-Axis Cutting Speed: 0.1–600 mm/s * Y1/Y2-Axis Cutting Range: 210 mm * Index Step: 0.0001 mm * Positioning Accuracy: Within 0.002 mm / 210 mm * Z-Axis Maximum Stroke: * 19.22 mm (2-inch blade) * 19.9 mm (3-inch blade) * Z-Axis Moving Resolution: 0.00005 mm * Z-Axis Repeatability: 0.001 mm * θ-Axis Maximum Rotation: 380° **Dimensions & Weight** * Dimensions (W × D × H): 1,180 × 1,110 × 1,850 mm * Equipment Weight: Approx. 1,600 kg **Key Features** * Facing dual-spindle configuration * High-throughput dicing capability * Automatic wafer loading, unloading, cleaning, and drying * LCD touchscreen operation * Suitable for wafer dicing and package singulation *Specifications may vary depending on machine configuration and options. Please confirm the actual specifications of the available unit.*Configuration
No ConfigurationOEM Model Description
The Disco DFD6340 is a Fully Automatic Dicing Saw that features a facing dual-spindle configuration with a shorter distance between blades, which improves throughput by up to 30% for step/bevel cut and 40% for dual cut when compared with parallel dual spindle dicing saws. It has the smallest footprint of any 8" saw in its class and utilizes an adjustable LCD touch screen graphical user interface making operation and maintenance intuitive and easy.Documents
No documents