Description
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Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The DFD6240 is a Fully Automatic Dicing Saw developed by DISCO Corporation. It is among the world’s smallest single spindle dicing saws with a Φ200 mm Single spindle. The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. It offers highly consistent and dependable cut quality through the new Synchro Spindle™ for superior radial rigidity.Documents
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DISCO
DFD6240
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116469
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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DISCO
DFD6240
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116469
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The DFD6240 is a Fully Automatic Dicing Saw developed by DISCO Corporation. It is among the world’s smallest single spindle dicing saws with a Φ200 mm Single spindle. The equipment is designed to reduce energy and air consumption, contributing to lower operation costs and environmental impact. It offers highly consistent and dependable cut quality through the new Synchro Spindle™ for superior radial rigidity.Documents
No documents