Description
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.Configuration
No ConfigurationOEM Model Description
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."Documents
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DISCO
DAD641
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
153663
Wafer Sizes:
Unknown
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Fully automatic wafer dicing saw for up to 8-inch wafers. Single spindle configuration, 1.0 kW spindle. Laser specifications and laser hours: N/A. Cutting material: Not specified.Configuration
No ConfigurationOEM Model Description
DFD641 has a maximum workpiece size of an ø8” wafer and features a 1.0 kW Synchro Spindle air bearing spindle. It can accommodate a maximum blade size of 61 mm and has a single spindle configuration. DFD641 also offers enhanced productivity through automatic alignment and is suitable for applications involving semiconductor devices."Documents
No documents