Description

DISCO DAD522 Automatic Dicing Saw Manufacturer: DISCO Model: DAD522 Equipment Type: Automatic Dicing Saw Maximum Workpiece Size: 6 inch (152.4 mm) Spindle Configuration: Single Spindle Spindle Power: 1.5 kW Maximum Spindle Speed: 40,000 rpm X-axis Cutting Range: 220 mm Y-axis Cutting Range: 160 mm X-axis Cutting Speed: 0.3–300 mm/s Indexing Step: 0.0001 mm X-axis Position Accuracy: ±0.005 mm / 160 mm Y-axis Position Accuracy: ±0.003 mm / 5 mm Z-axis Repeatability: 0.001 mm / 5 mm Maximum Blade Size: 3 inch (76.2 mm) Theta-axis Rotation: 380 degrees Power Supply: 200 V, 3-phase, 50/60 Hz Maximum Power: 3.5 kVA Automatic precision dicing saw designed for cutting silicon wafers, glass, and ceramics. Specifications may vary depending on machine configuration.

Configuration

No Configuration

OEM Model Description

discontinued Dec 2005

Documents

No documents

DISCO

DAD522

Verified

Scribing, Cutting, Dicing

Last Verified: 8 days ago

Key Item Details

Condition:

Used

Operational Status:

Deinstalled

Product ID:

153640

Wafer Sizes:

Unknown

Vintage:

2000

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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