Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Semi-autoOEM Model Description
2009 Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw. Ultra compact dual-spindle automatic dicing saw Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafersDocuments
No documents
DISCO
DAD3650
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116464
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
DISCO
DAD3650
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116464
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Semi-autoOEM Model Description
2009 Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw. Ultra compact dual-spindle automatic dicing saw Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafersDocuments
No documents