Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Semi-autoOEM Model Description
2009 Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw. Ultra compact dual-spindle automatic dicing saw Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafersDocuments
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DISCO
DAD3650
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116464
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DAD3650
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116464
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Semi-autoOEM Model Description
2009 Introducing the DAD3650, the world's smallest dual-spindle automatic dicing saw. Ultra compact dual-spindle automatic dicing saw Small footprint The optimal design of the DAD3650 combines high functionality and ultra compactness for a dual-spindle automatic dicing saw giving it a footprint 2/3 the size of the widely used single-spindle DAD3350 dicer for Φ8 inch wafersDocuments
No documents