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Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.Documents
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DISCO
DAD3360
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116465
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
2017
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Fully-autoOEM Model Description
The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.Documents
No documents