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DISCO DAD3360
    Description
    No description
    Configuration
    Unknown
    OEM Model Description
    The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.
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    DISCO

    DAD3360

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    94122


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    DISCO DAD3360
    DISCODAD3360Scribing, Cutting, Dicing
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    DISCO

    DAD3360

    verified-listing-icon

    Verified

    CATEGORY

    Scribing, Cutting, Dicing
    Last Verified: Over 60 days ago
    listing-photo-271651ac362d4b28bc63bd68283fcf54-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    94122


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Unknown
    OEM Model Description
    The Disco DAD3360 Automatic Dicing Saw is a Φ300 mm manual dicer that can meet a variety of needs. It offers exceptional processing flexibility while having an even more compact footprint than the existing DAD3350. Workpieces of sizes up to Φ300 mm are now supported and a high output 1.8 kW spindle is available as a standard option. The DAD3360 can cut not only silicon wafers but also products of a variety of sizes and materials such as large package substrates and electronic parts including SAW filters.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DAD3360
    DISCO
    DAD3360
    Scribing, Cutting, DicingVintage: 0Condition: UsedLast Verified: Over 60 days ago