Description
Microtome Cutter, only minor signs of use. No maintenance required. Equipped with a 1.8kW spindle capable of cutting wafers up to 250mm diameter. Supports processing of materials including optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.Configuration
No ConfigurationOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
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DISCO
DAD3350
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
140559
Wafer Sizes:
Unknown
Vintage:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Microtome Cutter, only minor signs of use. No maintenance required. Equipped with a 1.8kW spindle capable of cutting wafers up to 250mm diameter. Supports processing of materials including optical communication V-grooves, glass, and printed circuit boards with high precision and stable performance.Configuration
No ConfigurationOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
No documents