Description
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.Configuration
No ConfigurationOEM Model Description
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.Documents
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DISCO
DAD321
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
140558
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Microtome Wafer Cutter, Spindle speed: 40,000 rpm. Power: 3.5 kVA. Three-phase 200V. Weight: 500 kg.Configuration
No ConfigurationOEM Model Description
The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.Documents
No documents