Description

DISCO DAD321 Automatic Dicing Saw Manufacturer: DISCO Model: DAD321 Equipment Type: Automatic Dicing Saw Maximum Wafer Size: 6 inch (150 mm) Spindle Configuration: Single Spindle Spindle Type: Air Bearing Spindle Power: 1.5 kW Spindle Speed: 3,000–40,000 rpm X-axis Cutting Range: 192 mm Y-axis Cutting Range: 162 mm Z-axis Stroke: 32 mm Index Resolution: 0.0001 mm Theta-axis Rotation: 380 degrees Blade Size: 2 inch (standard configuration) Power Supply: 200 VAC, 3-phase Maximum Power Consumption: 2.5 kVA Machine Dimensions: 500 × 1,050 × 1,455 mm Machine Weight: Approx. 500 kg Automatic precision dicing saw designed for cutting silicon wafers and glass substrates. Specifications may vary depending on machine configuration.

Configuration

No Configuration

OEM Model Description

The DAD321 is an automatic dicing/cutting saw made by Disco Corporation. It is capable of handling wafers up to 6 inches in diameter and features an automatic theta rotation system. The unit is only 500mm wide and has a new 1.5kW SynchroSpindle that helps improve product quality.

Documents

No documents

DISCO

DAD321

Verified

Scribing, Cutting, Dicing

Last Verified: 8 days ago

Key Item Details

Condition:

Used

Operational Status:

Deinstalled

Product ID:

153599

Wafer Sizes:

Unknown

Vintage:

1997

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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