Description
Packaging products/wafer dicing machines 6-8-10 inch plateConfiguration
No ConfigurationOEM Model Description
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.Documents
No documents
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
103702
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ADVANCED DICING TECHNOLOGIES (ADT)
7900
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
103702
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Packaging products/wafer dicing machines 6-8-10 inch plateConfiguration
No ConfigurationOEM Model Description
The ADT 7900 series Dicing Saws feature two facing spindles, enabling simultaneous dicing of wafers or packages at a remarkable high throughput. This advanced system offers high accuracy, ensuring precise dicing of products with excellent performance. Additionally, the ADT 7900 series is designed to deliver exceptional results while maintaining a low cost of operation, making it a cost-effective solution for semiconductor manufacturing needs.Documents
No documents