Description
12-inch laser dicing machine with wafer handling system. We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.Configuration
Specifications Applicable Wafer size: Circular wafer : 8" to 12" X-axis : Stroke: 550mm Cutting feed rete: 0.1mm to 600mm/s Positioning resolution: 0.002mm Straightness: 0.0015mm/310mm(both horizontal and vertical) Y-axis: Stroke: 427mm Driving speed: max. 80mm/s Positioning resolution: 0.0002mm(closed loop control) Positioning accuracy: 0.002mm/310mm Z-axis: Stroke: 8. 5mm Driving speed: max. 100mm/s Positioning resolution: 0.0001mm(closed loop control) Positioning accuracy: 0.001mm/1mm • Others Power supply: Supply voltage : Selected from 20012201240/380/4 15 VAC ± 10% 3 phase, 50 to 60 Hz. Power consumption: 7kVA max Copressed air: Pressure : 0.5 to 0.7 MPa N2 gas: Pressure : 0.5 to 0.7 MPa Cooing water Cooling Water for thermal regulator(for Laser cooling): Pressure : 0.2 to 0.5MPa Dimentions: 1630w >< 2345° >< 2196Hmm Weight: 2500kgOEM Model Description
None ProvidedDocuments
ACCRETECH / TSK
ML300Plus-WH
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79186
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
ML300Plus-WH
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79186
Wafer Sizes:
8"/200mm, 12"/300mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available