Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Wafer Dicing Machine - The full automatic wafer dicing machine with the face-to-face twin-spindles, ready for the 300 mm wafer.Documents
No documents
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
104129
Wafer Sizes:
Unknown
Vintage:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
A-WD 300T
CATEGORY
Scribing, Cutting, Dicing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
104129
Wafer Sizes:
Unknown
Vintage:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
Wafer Dicing Machine - The full automatic wafer dicing machine with the face-to-face twin-spindles, ready for the 300 mm wafer.Documents
No documents