Description
• Maximum Board Size (X x Y) 609.6 mm x 508 mm, (24” x 20”) • Minimum Board Size (X x Y) 50.8 mm x 50.8 mm, (2” x 2”) • Board Thickness 0.2mm (0.008") to 5.0mm • Maximum Board Weight 4.5 kg (9.92 lbs) • Total System Alignment ±12.5 microns • Accuracy and Repeatability (±0.0005") at 6 sigma, Cpk of greater than or equal to 2.0* • Electrical Diagram Number: 1015011 • Power: 200-240 1KvaConfiguration
No ConfigurationOEM Model Description
The MPM Momentum family of printers by Speedline, including the Momentum series and new platform Momentum Compact, offer enhanced wet print accuracy for high precision and superior performance in meeting today’s emerging electronics assembly challenges.Documents
No documents
SPEEDLINE / MPM
MOMENTUM
Verified
CATEGORY
Screen Printer
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
68912
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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SPEEDLINE / MPM
MOMENTUM
CATEGORY
Screen Printer
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
68912
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
• Maximum Board Size (X x Y) 609.6 mm x 508 mm, (24” x 20”) • Minimum Board Size (X x Y) 50.8 mm x 50.8 mm, (2” x 2”) • Board Thickness 0.2mm (0.008") to 5.0mm • Maximum Board Weight 4.5 kg (9.92 lbs) • Total System Alignment ±12.5 microns • Accuracy and Repeatability (±0.0005") at 6 sigma, Cpk of greater than or equal to 2.0* • Electrical Diagram Number: 1015011 • Power: 200-240 1KvaConfiguration
No ConfigurationOEM Model Description
The MPM Momentum family of printers by Speedline, including the Momentum series and new platform Momentum Compact, offer enhanced wet print accuracy for high precision and superior performance in meeting today’s emerging electronics assembly challenges.Documents
No documents