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Description
No descriptionConfiguration
jipelec jetfirst Rapid Thermal Processor (RTP) - Max. 4 inches diameter Si Wafer. - Ramp rate 100 °C/sec max. - Vacuum = 10-2 mbar max. - Thermocouple, TC = 20 °C to 1000 °C readable. - Pyrometer = 400 °C to 1300 °C readable - Max. operating Temp. = 1200 °COEM Model Description
The Jetfirst RTP system was developed to meet university and research laboratory requirements. The temperature control system provides accurate and repeatable thermal control across the temperature range. The lamp array, upper flange, and quarts window are mounted in a rotating top lid, giving full access to the chamber for easy loading and unloading of the wafer.Documents
No documents
CATEGORY
RTP/RTA
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
56624
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
jipelec
JETFIRST
CATEGORY
RTP/RTA
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
56624
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
jipelec jetfirst Rapid Thermal Processor (RTP) - Max. 4 inches diameter Si Wafer. - Ramp rate 100 °C/sec max. - Vacuum = 10-2 mbar max. - Thermocouple, TC = 20 °C to 1000 °C readable. - Pyrometer = 400 °C to 1300 °C readable - Max. operating Temp. = 1200 °COEM Model Description
The Jetfirst RTP system was developed to meet university and research laboratory requirements. The temperature control system provides accurate and repeatable thermal control across the temperature range. The lamp array, upper flange, and quarts window are mounted in a rotating top lid, giving full access to the chamber for easy loading and unloading of the wafer.Documents
No documents