APPLIED MATERIALS (AMAT) VANTAGE RADIANCE Plus RTP

Description

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Configuration

-A Radiance Plus -B Radiance Plus (Fast Spike) Basic Equipment Specifications Compatible Wafers • Wafer Size: Supports 300mm (12-inch) wafers • Supported Wafer Standards: Compatible with SNNF specification wafers Chamber Type and Installation Location • Position A: RTP RadiancePlus 300mm • Position B: RTP RadiancePlus 300mm (Fast Spike) Customized Specifications Power Supply Specifications • Voltage: 200V/208V • Frequency: 50/60Hz Equipment Safety Specifications • Emergency Stop Button (EMO): Mainframe: 1 location Front-end Interface: 3 locations (both sides of the device) • EMO Button Type: Turn-to-release type, with guard ring • Safety Warning Labels: Written in both English and Japanese • Coolant Flow Switch: Yes • Gas Panel Door Switch: None • Water Leak Detector: Yes (main unit only) • RTP Chamber Over-temperature Sensor: 70°C • Enclosure Exhaust Static Pressure Switch: None • AC Box EMO Interface: Yes Position A & B: RTP Radiance Specifications • Chamber Type: RadiancePlus 300mm • Wafer Heating Method: Wafer surface heating with High Emission lamps (Cu Sleeve) × 409 units • Cooling Method: Water cooling (2 systems, each with a flow sensor) 1 system for chamber body, 2 systems for lamp heads • Temperature Control Method: Multi-point real-time remote control system Optical fibers: 7 + Optical fiber for RadiancePlus-specific Emissio (1 fiber) + Temperature controller (HRTS) + SCR driver (7 groups) • Temperature Measurement Frequency: Up to 100Hz • Temperature Measurement Range: 220°C ~ 1350°C (per company conditions) • Temperature Control Range: 220°C ~ 1350°C (per company conditions) • Maximum Heating Rate: 250°C/second (actual value per company conditions) • Pressure Control Range: 760 ~ 900 Torr • Pressure Control Method: PID Control (APC) • Vacuum Gauge (Baratron) + PCV (APC) • Vacuum Gauge: For pressure control — 1000 Torr (Baratron) Chamber Internal Mechanisms • Lift Mechanism: Lift pins for wafer transfer (three-point support, vertical motion) • Rotation Mechanism: Magnetic levitation mechanism Ch-A Postless Rotor Ch-B Fast Spike Rotor Power Supply: Continuous inverter power system Cooling Method: Forced air cooling • Wafer Rotation Speed: 240RPM (during heat treatment) Chamber Material • Base Ring: Stainless steel • Reflector Plate: Ch-A Standard, Ch-B Fast Spike • Edge Ring: Oxidized UniRing (specific to RadiancePlus) • Support Cylinder: Quartz • Lamp Window: Quartz • Lift Pins: Quartz • Open Loop Tuner (OLT): Yes • Oxygen Densitometer: Available for both Ch-A & Ch-B Gas Panel Specifications Standard Gas Panel • K1S Gas Panel (C-seal Type MFC) • Gas Flow Label: Yes • Gas Name Label: Yes Pressure Gauge/Regulator Specifications • Equipped with a pressure gauge and regulator. • Pressure display is on the monitor only (not on the gas panel). Gas Valve and Filter Specifications • Gas valves and filters cannot be separately specified or modified. • Components certified by Applied Materials, Inc. are used to ensure optimal specifications for each process. Process Gas Connection Specification • Standard gas connections are routed through the PreFacilitiesBox at the bottom of the device. Gas Panel Components • Gas Pipes/Fittings: SUS 316EP tube • Regulator: Yes • Pressure Transducer: Yes • Filter: Yes • Valve: Yes Chamber-A & B: Gas Types and MFC Size Specifications • N2 Process: 50SLM, SEC-Z500X Series (Piezo) • O2 Process: 50SLM, SEC-Z500X Series (Piezo) • O2 Process: 5SLM, SEC-Z500X Series (Piezo) • N2 Process: 50SLM, SEC-Z500X Series (Piezo) • He Cooling: 5SLM, SEC-Z500X Series (Piezo) • N2 Bottom Purge: 50SLM, SEC-Z500X Series (Piezo) • N2 Maglev Purge: 200SLM, SEC-Z500X Series (Piezo) • MFC Type: STEC • Lift Pin Purge Function: Yes Mainframe Specifications Common Frame Specifications • Vantage Frame: Designed for automation functions; supports up to two process chambers. • Connection Method: Connected via the PreFacilitiesBox. • Slit Valve: VAT-made slit valve • Chamber A Process: NON TOXIC • Chamber B Process: NON TOXIC • Rear Signal Tower: None • System Software: CGAFE • Chamber A AC Box: Yes (with EMO interface and SCR noise filter) • Chamber B AC Box: Yes (with EMO interface and SCR noise filter) Factory Interface Specifications Wafer Transfer Robot Specifications • Robot Type: Dual-arm robot • Number of Robots: 2 • Cold Blade Type: Ceramic blade • Hot Blade Type: U-Shape blade Wafer Storage Specifications • Pass-through: 2 slots • Cool-down: 3 slots FES&HRTS Server Specifications Load Port Specifications • Load Port Type: Supports 25 wafers (N2 Bottom Purge) • Number of Load Ports: 2 • E99 Carrier ID: TIRIS (RF) Hardware Specifications • Pressure Monitor: Yes • E84 Carrier Handoff: UPPER E84 Interface • E84 Standard PIO Sensor: not included (inch screw specification) • OHT Light Curtain: None • Signal Tower: 4 colors (red, yellow, green, blue; order can be changed), with buzzer • Chemical Filter: Yes • Ionizer: Yes Remote Specifications Device Control Monitor • Monitor Setup: LCD monitor and keyboard installed on a stand-alone cart. • Cable Length: Total 7.26m (25ft), Effective Length 4.88m (16ft)

OEM Model Description

The Applied Vantage RadiancePlus RTP system is the industry-leading, high-productivity solution for high-volume, atmospheric RTP applications, combining world-class RTP chamber technology with a production-proven, low cost-of-ownership platform. Its streamlined design allows for shipment as a single unit, enabling faster start-up and shorter time to production.