Description
Tool is complete, there are no missing parts.Configuration
FAaST 230 - DP + SPVOEM Model Description
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.Documents
No documents
SEMILAB / SDI
FAAST 230 DP+SPV
Verified
CATEGORY
Reticle / Mask Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15230
Wafer Sizes:
Unknown
Vintage:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SEMILAB / SDI
FAAST 230 DP+SPV
CATEGORY
Reticle / Mask Inspection
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
15230
Wafer Sizes:
Unknown
Vintage:
1999
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Tool is complete, there are no missing parts.Configuration
FAaST 230 - DP + SPVOEM Model Description
The SEMILAB / SDI FAAST 230 DP+SPV is an inspection system for wafer masks that can handle cassettes of up to 200mm wafers. It is designed to quickly monitor heavy metal contamination in a non-contact, in-line manner, including the detection of sub 10^8 atoms/cm^-3 Fe. The system is suitable for medium to high-volume manufacturing environments and features automated wafer handling. It also includes automatic robotic wafer handling, a single open-cassette wafer loading station with various configurable options, and automatic full wafer FAST mapping of diffusion length, Iron, and other recombination centers. Additionally, it has the option for advanced digital SPV functions such as Backsurface Recombination, Steady State Diffusion Length, and Copper measurements.Documents
No documents