Description
Mask Inspection & Repair SystemConfiguration
· Model: RAVE Merlin-G · Wafer Size: 6 inch photomasks · Factory Interface with 1 load port for SMIF pod RSP-200 · Separate climate control unit to supply conditioned air for main chamber environmental control. · Optics: o Laser interferometer system: Reflects a Helium-Neon 4 laser (Class IIIA with 4 mW input power and up to 1.3 mW output power) off the cantilever to detect NANOBITS® motion o Laser autofocus system: Uses a Class II laser diode with less than 1 mW output power in a viewing optics column. · Transfer Robot: o Fully automated, Iso Class 1 SMIF interface to transfer mask from load station to an X/Y positioning table. · Photomask Repair: o AFM-guided, production-grade 15 nm technology node mask repair on Chrome, EPSM, APSM, Quartz, foreign materials, and persistent particles with accuracy and precision suitable for 10 nm node development. Edge Placement: 50 Å (± from target). o Standard BitClean® Function featuring hardware/software automation that provides final pre-pellicle local clean capability using the nanomachining tip for the removal of persistent particle contamination. o Depth (Z) Control towards target permits repairs to be matched to 30 Å (± from target).OEM Model Description
high-precision, 15-nanometer mask repair nanomachineDocuments
No documents
RAVE LLC
Merlin-G
CATEGORY
Reticle / Mask Inspection
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
155081
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Mask Inspection & Repair SystemConfiguration
· Model: RAVE Merlin-G · Wafer Size: 6 inch photomasks · Factory Interface with 1 load port for SMIF pod RSP-200 · Separate climate control unit to supply conditioned air for main chamber environmental control. · Optics: o Laser interferometer system: Reflects a Helium-Neon 4 laser (Class IIIA with 4 mW input power and up to 1.3 mW output power) off the cantilever to detect NANOBITS® motion o Laser autofocus system: Uses a Class II laser diode with less than 1 mW output power in a viewing optics column. · Transfer Robot: o Fully automated, Iso Class 1 SMIF interface to transfer mask from load station to an X/Y positioning table. · Photomask Repair: o AFM-guided, production-grade 15 nm technology node mask repair on Chrome, EPSM, APSM, Quartz, foreign materials, and persistent particles with accuracy and precision suitable for 10 nm node development. Edge Placement: 50 Å (± from target). o Standard BitClean® Function featuring hardware/software automation that provides final pre-pellicle local clean capability using the nanomachining tip for the removal of persistent particle contamination. o Depth (Z) Control towards target permits repairs to be matched to 30 Å (± from target).OEM Model Description
high-precision, 15-nanometer mask repair nanomachineDocuments
No documents