Description
PVD Cluster Tool Missing Parts The main design features of the system include:- a. Sputter up deposition with gravity retaining. No clips or clamps needed. b. S-Gun magnetron advanced DC source. You can run a recipe on the wafer with up to 50 steps with different parameters for sputtering. Each wafer loaded can be run through a different sequence of sputtering. The S-Gun magnetron sputtering system has the following design features. Plasma is produced in the chambers in 2 concentric rings. One for each magnetron and target. Between them, there is the shield region.Configuration
PVD PM1 ETCH PM2 Al PM3 Cu PM4 NiV PM5 TiOEM Model Description
Endeavor AT – an exceptional single-wafer processing solution designed in a cluster style and operating within a high-vacuum environment. The innovative S-Gun sputter source design, protected by a patent, empowers operators with meticulous command over process variables, while also granting the freedom to forge novel processes. Crafted with an unwavering commitment to superior outcomes, streamlined design, user-friendly maintenance, and unwavering dependability, each system exemplifies a dedication to excellence.Documents
No documents
CATEGORY
PVD / Sputtering
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
148404
Wafer Sizes:
6"/150mm
Vintage:
1990
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SPUTTERED FILMS INC / SFI
ENDEAVOR AT
CATEGORY
PVD / Sputtering
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
148404
Wafer Sizes:
6"/150mm
Vintage:
1990
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
PVD Cluster Tool Missing Parts The main design features of the system include:- a. Sputter up deposition with gravity retaining. No clips or clamps needed. b. S-Gun magnetron advanced DC source. You can run a recipe on the wafer with up to 50 steps with different parameters for sputtering. Each wafer loaded can be run through a different sequence of sputtering. The S-Gun magnetron sputtering system has the following design features. Plasma is produced in the chambers in 2 concentric rings. One for each magnetron and target. Between them, there is the shield region.Configuration
PVD PM1 ETCH PM2 Al PM3 Cu PM4 NiV PM5 TiOEM Model Description
Endeavor AT – an exceptional single-wafer processing solution designed in a cluster style and operating within a high-vacuum environment. The innovative S-Gun sputter source design, protected by a patent, empowers operators with meticulous command over process variables, while also granting the freedom to forge novel processes. Crafted with an unwavering commitment to superior outcomes, streamlined design, user-friendly maintenance, and unwavering dependability, each system exemplifies a dedication to excellence.Documents
No documents