Description
UBM DEPConfiguration
No ConfigurationOEM Model Description
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)Documents
No documents
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127983
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVATEC / UNAXIS / OERLIKON / BALZERS
CLUSTERLINE 300
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127983
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
UBM DEPConfiguration
No ConfigurationOEM Model Description
The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology. System Highlights Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics. -Integration of single process modules for PVD, highly ionized PVD, and Soft Etch -Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; -200/300mm bridge or split tool compliant -New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications -Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm -Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)Documents
No documents