System configuration: Cluster-type (EC7000 sputtering chamber ×1, EC7001 sputtering chamber ×2) Tray transport method
Substrate size: φ200mm maximum
Cathode: φ4" cathode ×3 (Option: φ12.5" cathode ×1, φ4" cathode ×4)
Operation method: Fully automated (pumping, transport, deposition)

CANON acquired ANELVA and became CANON ANELVA Corporation which focuses on: Vacuum thin-film deposition and processing equipment, semiconductor device manufacturing equipment, storage device manufacturing equipment, equipment for electronic device manufacturing and for R&D, maintenance service, and vacuum components.


EC7000

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