EB1000
Category
PVD / SputteringOverview
System configuration: Tray transport method (Load lock is option) Substrate size: φ150mm maximum (Have it of load lock;greatest φ100mm) Cathode: φ2" cathode ×3 Operation method: Auto pumping operation, manual transport/deposit operation Footprint: W1800mm×D1100mm×H1550mm (standard specification)
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