Description
DepositionConfiguration
Chamber Types & Process: - CH1: Ti (heater 4F) - CH2: TIN (pedestal) - CH3: Alu 4F (heater) - CH4:Alu 4F (heater) - CHA: Pass-thru - CHB: Cooldown - CHC: Preclean II - CHE: Clamped degas (heater) - CHF:Standard orient degasOEM Model Description
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.Documents
No documents
CATEGORY
PVD / Sputtering
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145551
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
ENDURA 5500
CATEGORY
PVD / Sputtering
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145551
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
DepositionConfiguration
Chamber Types & Process: - CH1: Ti (heater 4F) - CH2: TIN (pedestal) - CH3: Alu 4F (heater) - CH4:Alu 4F (heater) - CHA: Pass-thru - CHB: Cooldown - CHC: Preclean II - CHE: Clamped degas (heater) - CHF:Standard orient degasOEM Model Description
AMAT leveraged its expertise in single-wafer, multichamber architecture to develop an evolutionary platform called the Endura 5500 PVD (physical vapor deposition) in 1990 featuring a staged, ultra-high vacuum architecture for the rapid sputtering of aluminum and other metal films used to form the circuit interconnections on advanced devices.Documents
No documents