Description

Metal Barrier Deposition Platform Mainframe (7,334 lb) · Factory Interface (3,692 lb) Details Attached

Configuration

Metal PVD Chambers can support the PVD Cu barrier process directionality unit for sub-5nm contact/via fill (Sputters into contacts & vias ≤ 5nm) Degas chambers are intact (eSIP TaN · Tin –Multiple Degas) PVD Cu Barrier Directional eSIP TaN (barrier/seed) Mainframe (7,334 lb) · Factory Interface (3,692 lb) Chamber positions 1, 2, 3, E, F · XP motion controller Cryo compressor · DI cooler · Main AC · System AC 3×equipment racks · fusebox · transformer · crane jibs

OEM Model Description

Endura systems revolutionized semiconductor metallization by delivering breakthrough technologies and levels of reliability, serviceability and flexibility that far surpassed existing capabilities

Documents

amat_endura.pdf

APPLIED MATERIALS (AMAT)

ENDURA

Verified

PVD / Sputtering

Last Verified: 5 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

152747

Wafer Sizes:

12"/300mm

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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