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MARTEK / ELECTROGLAS (EG) PATHFINDER
  • MARTEK / ELECTROGLAS (EG) PATHFINDER
  • MARTEK / ELECTROGLAS (EG) PATHFINDER
  • MARTEK / ELECTROGLAS (EG) PATHFINDER
Description
No description
Configuration
No Configuration
OEM Model Description
Pathfinder: Introduced in 2002, the Pathfinder system is designed to meet the unique test handling requirements of the Known Good Die (KGD) and Chip-scale package markets. The Pathfinder system features a unique material handling system that can handle and position wafers and packages after they have been sawn (“diced”). Special alignment techniques are used to compensate for the variability inherent in these sawn wafers and packages.
Documents

No documents

CATEGORY
Probers

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

18292


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

MARTEK / ELECTROGLAS (EG)

PATHFINDER

verified-listing-icon
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
listing-photo-khmZbZbgqjb54LLk_zSKbPIKzRSIt9srWtVIl2uhxMQ-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

18292


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
Pathfinder: Introduced in 2002, the Pathfinder system is designed to meet the unique test handling requirements of the Known Good Die (KGD) and Chip-scale package markets. The Pathfinder system features a unique material handling system that can handle and position wafers and packages after they have been sawn (“diced”). Special alignment techniques are used to compensate for the variability inherent in these sawn wafers and packages.
Documents

No documents