Description
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Number of Cassette Elevators 2 Wafer Handling Random Access Robot Accuracy ± 2.00 % Vacuum Chuck -Diameter 7.8740 in (200.00 mm) -Plating Material Nickel/Gold -Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)OEM Model Description
The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.Documents
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ACCRETECH / TSK
UF200
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101933
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ACCRETECH / TSK
UF200
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101933
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
1998
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Number of Cassette Elevators 2 Wafer Handling Random Access Robot Accuracy ± 2.00 % Vacuum Chuck -Diameter 7.8740 in (200.00 mm) -Plating Material Nickel/Gold -Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)OEM Model Description
The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.Documents
No documents