The W-GM-3200 is a high-throughput, space-saving Wafer Edge Grinding Machine. It is capable of grinding two wafers at a time, increasing efficiency and productivity. The machine also features a TFT color LCD intelligent display, providing high operability and ease of use. With its advanced capabilities and user-friendly design, the W-GM-3200 is an excellent choice for wafer edge grinding.

Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines*
Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*



W-GM-3200

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