Description
Silvia 2ch / Axiom 1chConfiguration
Silvia 2ch / Axiom 1chOEM Model Description
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.Documents
No documents
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
Verified
CATEGORY
Plasma Etch
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75693
Wafer Sizes:
12"/300mm
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA Silvia Etch
Verified
CATEGORY
Plasma Etch
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75693
Wafer Sizes:
12"/300mm
Vintage:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Silvia 2ch / Axiom 1chConfiguration
Silvia 2ch / Axiom 1chOEM Model Description
Applied Materials Centura Silvia Etch system is specifically designed for the challenging deep silicon etch required to create the vertical connections between the chips or wafers. It overcomes the tradeoff between profile control and high etch rate faced by conventional methods. The system’s high-density plasma source enables the highest silicon and oxide etch rates for all wafer-level packaging applications.Documents
No documents