Description
No descriptionConfiguration
Frame is a AMAT Centura II Hybrid with 3 process chambers CENTURA 5200 IPS and one EMAX process chamber.OEM Model Description
Etch system delivers high-productivity silicon, metal, and dielectric etch. The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers. For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.Documents
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APPLIED MATERIALS (AMAT)
CENTURA 5200 IPS
Verified
CATEGORY
Plasma Etch
Last Verified: 18 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103686
Wafer Sizes:
Unknown
Vintage:
2002
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
CENTURA 5200 IPS
CATEGORY
Plasma Etch
Last Verified: 18 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103686
Wafer Sizes:
Unknown
Vintage:
2002
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Frame is a AMAT Centura II Hybrid with 3 process chambers CENTURA 5200 IPS and one EMAX process chamber.OEM Model Description
Etch system delivers high-productivity silicon, metal, and dielectric etch. The Centura and Centura AP mainframe single-wafer, multi-chamber architectures enable integrated, sequential wafer processing in up to four process chambers for 150mm, 200mm, and 300mm wafers. For 150/200mm wafers, Applied Centura DPS® DTM system employs advanced deep reactive ion etch (DRIE) for a range of materials to precisely control etch wall smoothness and trench profile, while delivering high aspect ratio capability and achieving high throughput. Applied Centura DPS Plus is the industry standard for metal etch processes.Documents
No documents