Description
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTIONConfiguration
No ConfigurationOEM Model Description
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.Documents
No documents
ROYCE INSTRUMENTS
DE-35
Verified
CATEGORY
Pick and Place
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
63979
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ROYCE INSTRUMENTS
DE-35
CATEGORY
Pick and Place
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
63979
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ROYCE A45/DE35 SEMI-AUTO DIE SORTER PICKS OFF UP TO 6″ WAFER AND AUTOMATICALLY LOADS WAFFLE PACKS MOTORIZED INPUT TABLE WITH MANUAL DIE SELECTIONConfiguration
No ConfigurationOEM Model Description
The Royce Instruments DE-35 is a semi-automatic die pick and place system used in the semiconductor industry. It is available for up to 200mm dia wafers standard, 300mm wafers special order and has a throughput of 700 to 1200 UPH, application dependent. The DE-35 has quick change multi-needle eject heads and an output stage for waffle packs, Gel-Paks, film frames etc. Options include non-surface contact die picking, die inverter, die underside inspection and high magnification die facet (edge) inspection.Documents
No documents