Description
Head design with Placement beam equipped with 8 SF (Super Fine) Heads! Moves in X/Y and Z Direction Type: PA 1314/03 Line Array Camera 45mm "on the fly" alignment with lead pitches down to 20mil (0.5mm) Includes OPTIONAL CCD Camera that extends component range to 32mm with Lead pitches down to 16mil (0.4mm) Optimal Placement Rate: 11,600 CPH IPC 9850 Placement Rate: 9,600 CPH Operating System: WINDOWS NT Large board Capacity: 25.6 x 33.46 inches (650 x 850mm) / Min 2.0 x 2.0inches (50 x 50mm) Max Board size with Automatic Nozzle Exchange: 18.11 x 17.32 inches (460 x 440mm) Vision System with Line Array Camera enables Fast & Accurate "On-the-Fly" Alignment Component range: 01005 (0402) to 45 x 100mm (BGA, µBGA, CSP, Connector, Odds) Holds 100 tape feeders Nozzle exchange holds 20 Nozzle positions Machine Dims L x W x H: 5.4 ft (1650mm) x 4.5 ft (1408mm) x 6.1 ft (1850mm) Weight 3526 lbs (1600kg)Configuration
No ConfigurationOEM Model Description
The Assembleon Opal-XII is a well-regarded pick and place machine known for its excellent condition and available feeders. It boasts a placement rate of 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) and 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads). The machine is capable of handling components ranging in size from 01005 (0402) to 45 mm sq. (1.8” sq.) and has a fine pitch accuracy of 35 microns @ 3 sigma. The Opal-XII is essentially a more compact version of the Topaz-XII, with slightly lower component output but the same placement accuracy and board size. Both systems are capable of placing everything from small 01005 components to large CSPs, Flip Chips, BGAs, and fine pitch QFPs.Documents
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PHILIPS / ASSEMBLEON
OPAL-XII
Verified
CATEGORY
Pick and Place
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
68907
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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Similar Listings
View AllPHILIPS / ASSEMBLEON
OPAL-XII
CATEGORY
Pick and Place
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
68907
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Head design with Placement beam equipped with 8 SF (Super Fine) Heads! Moves in X/Y and Z Direction Type: PA 1314/03 Line Array Camera 45mm "on the fly" alignment with lead pitches down to 20mil (0.5mm) Includes OPTIONAL CCD Camera that extends component range to 32mm with Lead pitches down to 16mil (0.4mm) Optimal Placement Rate: 11,600 CPH IPC 9850 Placement Rate: 9,600 CPH Operating System: WINDOWS NT Large board Capacity: 25.6 x 33.46 inches (650 x 850mm) / Min 2.0 x 2.0inches (50 x 50mm) Max Board size with Automatic Nozzle Exchange: 18.11 x 17.32 inches (460 x 440mm) Vision System with Line Array Camera enables Fast & Accurate "On-the-Fly" Alignment Component range: 01005 (0402) to 45 x 100mm (BGA, µBGA, CSP, Connector, Odds) Holds 100 tape feeders Nozzle exchange holds 20 Nozzle positions Machine Dims L x W x H: 5.4 ft (1650mm) x 4.5 ft (1408mm) x 6.1 ft (1850mm) Weight 3526 lbs (1600kg)Configuration
No ConfigurationOEM Model Description
The Assembleon Opal-XII is a well-regarded pick and place machine known for its excellent condition and available feeders. It boasts a placement rate of 9.6k / 11.6k cph (IPC 9850 / rated for Opal-X” with 4 heads) and 13.9k / 17.7k cph (IPC 9850 / rated for Opal-X” with 8 heads). The machine is capable of handling components ranging in size from 01005 (0402) to 45 mm sq. (1.8” sq.) and has a fine pitch accuracy of 35 microns @ 3 sigma. The Opal-XII is essentially a more compact version of the Topaz-XII, with slightly lower component output but the same placement accuracy and board size. Both systems are capable of placing everything from small 01005 components to large CSPs, Flip Chips, BGAs, and fine pitch QFPs.Documents
No documents