Description
Placement machineConfiguration
CPP+TH, without WPC6OEM Model Description
The ASMPT SIPLACE SX2 is an advanced pick and place system equipped with high-speed production capabilities and increased accuracy and flexibility. This smart and open platform is designed to adapt quickly to various challenges, making it an ideal solution for semiconductor manufacturing. With a placement speed of 86,500 cph (components per hour) and a feeder capacity of 120 × 8-mm slots, it ensures efficient and reliable production processes. The SIPLACE SX2 supports a wide component spectrum from 0201 (metric) to 200 mm × 125 mm × 50 mm, enabling it to handle a diverse range of components. Its board size capabilities range from 50 mm × 50 mm to 1,525 mm × 560 mm, accommodating various PCB sizes. The system comes with different placement heads, including SpeedStar (CP20P2), MultiStar (CPP), and TwinStar (TH), ensuring versatility and adaptability for different production requirements.Documents
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ASMPT / SIEMENS
SIPLACE SX2
Verified
CATEGORY
Pick and Place
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
105304
Wafer Sizes:
Unknown
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllASMPT / SIEMENS
SIPLACE SX2
CATEGORY
Pick and Place
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
105304
Wafer Sizes:
Unknown
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Placement machineConfiguration
CPP+TH, without WPC6OEM Model Description
The ASMPT SIPLACE SX2 is an advanced pick and place system equipped with high-speed production capabilities and increased accuracy and flexibility. This smart and open platform is designed to adapt quickly to various challenges, making it an ideal solution for semiconductor manufacturing. With a placement speed of 86,500 cph (components per hour) and a feeder capacity of 120 × 8-mm slots, it ensures efficient and reliable production processes. The SIPLACE SX2 supports a wide component spectrum from 0201 (metric) to 200 mm × 125 mm × 50 mm, enabling it to handle a diverse range of components. Its board size capabilities range from 50 mm × 50 mm to 1,525 mm × 560 mm, accommodating various PCB sizes. The system comes with different placement heads, including SpeedStar (CP20P2), MultiStar (CPP), and TwinStar (TH), ensuring versatility and adaptability for different production requirements.Documents
No documents